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 Home > Capability > FPCB Capability |
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Flexible Capability: |
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Remarks and Testing |
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Materials |
Kapton, Polyimide, PET |
FR4 for Rigid |
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Stiffener Materials |
Polyimide, PET, FR4, SUS |
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Flexible Board Layers |
1-4 Layers |
Prototype 6 Layers |
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Rigid-Flex Board Layers |
2-10 Layers |
Prototype 12 Layers |
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Max. Panel Size |
250mm*400mm |
12.6mm*30m, The whole roll production |
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Min.Track Width/Space |
0.051mm/0.076mm |
0.051mm/0.051mm |
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Min. Board Thickness |
Single：0.1mm |
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2 layers：0.13mm |
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4 layers：0.30mm |
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6 layers：0.50mm |
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Min. Hole Size |
Drill Hole: 0.20mm |
0.15mm for Prototype |
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Punching Hole：0.50mm |
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Aspect Ratio |
6:1 |
8:1 |
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Base Copper |
1/3Oz -- 2Oz |
3 Oz for Prototype |
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Size Tolerance |
Conductor Width：±10% |
W ≤ 0.5mm |
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Hole Size： ±0.05mm |
H ≤ 1.5mm |
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Hole Registration： ±0.050mm |
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Outline Tolerance：±0.075mm |
L ≤ 50mm |
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Surface Treatment |
ENIG: 0.025um - 3um |
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OSP: |
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Immersion Tin: 0.04-1.5um |
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Dielectric Strength |
AC500V |
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Solder Float |
288℃/10s |
IPC Standard |
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Peeling Strength |
1.0kgf/cm |
IPC-TM-650 |
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Flammability |
94V-O |
UL94 |
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