New LED Packaging Solution
I-Connect007 will be interviewing Hitechpcb Vice President Jack as part of their Real Time with...IPC Expo 2010. Hitechpcb provided key features of the new thermal management material product that Saturn is currently developing to replace standard solutions like metal core / aluminum PCB substrates.
Current "Premium" / Default Thermal Management Dielectrics
The new LED Aluminium PCB
material features thermal conductivity 4 times that of pure copper. Pure copper has 200 times the thermal conductivity of today's prevalent trend of accepted thermal management dielectrics.
In addition, the Saturn booth will be playing the LED PCB Design Webinar at the booth throughout the entire event.
Sign up for the archived MCPCB webinar.
A metal base PCB (aluminum PCB), or thermal interface material, is brought into contact with the components' surface. Temperature is reduced through increased thermal mass and heat dissipation (conduction and convection). Utilizing our existing multilayer registration system, we are able to register a PCB heatsink within 5 mils prior to bonding.
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